Thermodynamic and Kinetic Properties of Grain Boundary Junctions

被引：1

作者：

Shvindlerman, L. S. ^{[1
]}

Gottstein, G. ^{[1
]}

机构：

[1] Rhein Westfal TH Aachen, Inst Metallkunde & Metallphys, Aachen, Germany

来源：

RECRYSTALLIZATION AND GRAIN GROWTH IV | 2012年 / 715-716卷

关键词：

grain boundary; grain boundary triple junction; grain boundary quadruple junction; TRIPLE JUNCTIONS; GROWTH; MOBILITY; ENERGY; MOTION;

D O I：

10.4028/www.scientific.net/MSF.715-716.243

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The results of recent experimental, theoretical and computer simulation studies of the thermodynamics and kinetics of grain boundaries and grain boundary junctions are presented and discussed.

引用

页码：243 / 250

页数：8

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