Thermodynamic and Kinetic Properties of Grain Boundary Junctions

被引：1
作者：
Shvindlerman, L. S. [1 ]
Gottstein, G. [1 ]
机构：
[1] Rhein Westfal TH Aachen, Inst Metallkunde & Metallphys, Aachen, Germany
来源：
RECRYSTALLIZATION AND GRAIN GROWTH IV | 2012年 / 715-716卷
关键词：
grain boundary; grain boundary triple junction; grain boundary quadruple junction; TRIPLE JUNCTIONS; GROWTH; MOBILITY; ENERGY; MOTION;
D O I：
10.4028/www.scientific.net/MSF.715-716.243
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
The results of recent experimental, theoretical and computer simulation studies of the thermodynamics and kinetics of grain boundaries and grain boundary junctions are presented and discussed.
引用
收藏
页码：243 / 250
页数：8
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