"FlexTrate™" - Scaled Heterogeneous Integration on Flexible Biocompatible Substrates using FOWLP

被引：19

作者：

Fukushima, Takafumi ^{[1
,2
]}

Alam, Arsalan ^{[1
]}

Wan, Zhe ^{[1
]}

Jangam, Siva C. ^{[1
]}

Pal, Saptadeep ^{[1
]}

Ezhilarasu, Goutham ^{[1
]}

Bajwa, Adeel ^{[1
]}

Iyer, Subramanian S. ^{[1
]}

机构：

[1] UCLA, CHIPS, EE Dept, Los Angeles, CA 90024 USA

[2] Tohoku Univ, Dept Mech Syst Engn, Sendai, Miyagi, Japan

来源：

2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017) | 2017年

关键词：

Flexible device integration; Biocompatible; FOWLP; Bendable interconnect; Metallization of PDMS;

D O I：

10.1109/ECTC.2017.226

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We have developed a novel fan-out wafer level packaging (FOWLP) technology for high-performance and scalable flexible and biocompatible substrates that we call FlexTrate (TM). We demonstrate the technology with the assembly of 1-mm-sqaure 625 (25 by 25) Si dielets on a biocompatible Polydimethylsiloxane (PDMS). By using the new FOWLP technology, die-die interconnects with a pitch of 10 mu m or less were implemented on the array of the Si dielets embedded in the PDMS.

引用

页码：649 / 654

页数：6

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