Properties of nanocrystalline CuCr50 contact material

被引:15
作者
Zhang, CY [1 ]
Yang, ZM
Wang, YP
Ding, BJ
机构
[1] Xian Jiaotong Univ, Sch Sci, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China
[2] Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
关键词
D O I
10.1002/adem.200500139
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The properties and microstructure as well as surface morphology of nanocrystalline CuCr50 (nc-CuCr50) prepared by hot press sintering techniques (HPS) were investigated. The grain size of nanocrystalline CuCr50 alloy was found to be less than 50 nm. It was found that the breakdown strength of nc-CuCr50 is 2.96 × 108 V/m. It was suggested that the low erosion rate and high breakdown strength were due to the slight surface melting and formation of small droplets during arcing.
引用
收藏
页码:1114 / 1117
页数:4
相关论文
共 14 条
[1]   Influence of microstructure on dielectric strength of CuCr contact materials in a vacuum [J].
Ding, BJ ;
Yang, ZM ;
Wang, XT .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1996, 19 (01) :76-81
[2]   Particle-induced erosion of materials at elevated temperature [J].
Doerner, RP ;
Krasheninnikov, SI ;
Schmid, K .
JOURNAL OF APPLIED PHYSICS, 2004, 95 (08) :4471-4475
[3]   Cathode spots of electric arcs [J].
Jüttner, B .
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2001, 34 (17) :R103-R123
[4]  
LAFFERTY JM, 1980, VACUUM ARCS THEORY A
[5]  
MULLER R, 1988, SIEMENS FORSCH ENTW, V17, P105
[6]   THE INFLUENCE OF COMPOSITION AND CR PARTICLE-SIZE OF CU/CR CONTACTS ON CHOPPING CURRENT, CONTACT RESISTANCE, AND BREAKDOWN VOLTAGE IN VACUUM INTERRUPTERS [J].
RIEDER, WF ;
SCHUSSEK, M ;
GLATZLE, W ;
KNY, E .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1989, 12 (02) :273-283
[7]   Influence of contact geometry and current on effective erosion of Cu-Cr, Ag-WC, and Ag-Cr vacuum contact materials [J].
Schulman, MB ;
Slade, PG ;
Loud, LD ;
Li, WP .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 1999, 22 (03) :405-413
[8]   ADVANCES IN MATERIAL DEVELOPMENT FOR HIGH-POWER, VACUUM INTERRUPTER CONTACTS [J].
SLADE, PG .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1994, 17 (01) :96-106
[9]   Mechanical alloying and milling [J].
Suryanarayana, C .
PROGRESS IN MATERIALS SCIENCE, 2001, 46 (1-2) :1-184
[10]   EROSION PRODUCTS FROM CATHODE SPOT REGION OF A COPPER VACUUM ARC [J].
TUMA, DT ;
CHEN, CL ;
DAVIES, DK .
JOURNAL OF APPLIED PHYSICS, 1978, 49 (07) :3821-3831