Design of a Capacitive Pressure Sensor Based On Flip-Chip Packaging Technology

被引：0
|
作者：
Nie, Meng [1 ]
Huang, Qing-An [1 ]
Qin, Ming [1 ]
Li, Wei-Hua [1 ]
机构：
[1] Southeast Univ, Key Lab MEMS, Minist Educ, Nanjing 210096, Jiangsu, Peoples R China
来源：
2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP) | 2010年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper proposed a capacitive pressure sensor using flip-chip packaging technology to seal the vacuum cavity, and the sensing part is a variable capacitor with conductor/dielectric/conductor structure. Mechanical characteristics of the sensor were theoretically analyzed based on a composite membrane theory and evaluated by finite element analysis (FEA), showing that the difference of the model is within 8% compared to finite element analysis results. The back side flip-chip process can achieve wafer-level vacuum cavity packaging avoiding high voltage applied during conventional anodic bonding process and at the same time resolving the feed-through problem.
引用
收藏
页码：538 / 541
页数：4
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