High-κ Gate Dielectrices for Nanoscale CMOS Devices: Status, Challenges, and Future

被引:7
作者
Park, Dae-Gyu [1 ]
Wang, Xinlin [2 ]
机构
[1] IBM TJ Watson Res Ctr, 1101 Kitchawan Rd,Route 134,PO 218, Yorktown Hts, NY 10598 USA
[2] IBM Corp, Semicond R&D Ctr, Div Microelect, Hopewell Jct, NY 12533 USA
来源
DIELECTRICS FOR NANOSYSTEMS 4: MATERIALS SCIENCE, PROCESSING, RELIABILITY, AND MANUFACTURING | 2010年 / 28卷 / 02期
关键词
BORON PENETRATION; METAL; TECHNOLOGY;
D O I
10.1149/1.3372562
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
This paper describes historical efforts of replacing SiO2 by high-k dielectric, and an implementation of high-k/metal gate (HK/MG) gate stack into the product level of industry standard low power bulk technology and high performance silicon-on-insulator (SOI) complementary metal-oxide-semiconductor (CMOS) devices. HK/MG stack provides further device scaling in channel length and inversion thickness (T-inv), leading to enable contact gate pitch scaling. Mobility degradation with T-inv scaling and threshold voltage (V-t) variability due to random telegraph noise and random dopant fluctuations at 15nm node and beyond are discussed, followed by outlook of future generation CMOS devices.
引用
收藏
页码:39 / +
页数:2
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