Mechanism Design and Dynamic Simulation of Die Bonding Machines

被引：0

作者：

Cao, Zhanlun ^{[1
]}

Wu, Xiaohong ^{[1
]}

Gao, Jian ^{[1
]}

Jiang, Yongjun ^{[1
]}

Chen, Xin ^{[1
]}

机构：

[1] Guangdong Univ Technol, Sch Electromech Engn, Guangzhou 510006, Guangdong, Peoples R China

来源：

2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) | 2012年

关键词：

Bonding mechanism; Rigid-flexible coupling; Simulation and Analysis; ADAMS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Because die-bonding mechanism is precision machinery, the high-speed bonding head must be meet designed displacement and the force must be kept within a certain range. In this paper, a 3D model of a bonding mechanism was designed and implemented within SolidWorks (R) software, and analyzed dynamically in ADAMS (R) software. Through the motion simulation to designed velocity, the displacement curve and the bonding force curve were obtained. The graphs yielded by simulating show that the movement and the bonding force of the pick-up head meet the design criterion and the die attach process of a die bonder. Based on the analysis result, a die bonding machine is designed and manufactured.

引用

页码：1009 / 1012

页数：4

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