A critical comparison and development of nano-mechanical characterization of MEMS/NEMS thin film materials

被引:0
作者
He, Johnny H. [1 ]
Le, H. R. [2 ]
Luo, J. K. [2 ]
Fu, Y. Q. [2 ]
Moore, D. F. [2 ]
机构
[1] Inst Microelect, 11 Sci Pk Rd,Sci Pk 2, Singapore 117685, Singapore
[2] Univ Cambridge, Dept Engn, Cambridge CB2 1TN, England
来源
RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/ MOEMS V | 2006年 / 6111卷
关键词
cantilevers; MEMS/NEMS; micro-nano; mechanical characterization; nano-indentation; resonance frequency;
D O I
10.1117/12.647295
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper compared the three different methods for determination of thin film modulus or MEMS applications: 1) scanning bending cantilever, 2) nanoindentation and 3) resonance frequency method. Surface profilometer was used to scan along the micro-machined cantilevers at different loads and produce the bending profile, from which the Young's modulus can be extracted. Indentation profiled produced by Nano-indenter can deduce Young's modulus and hardness of the thin film materials. AFM vibrometer is used to detect the resonance of the thin film cantilever, from which the stiffness, and therefore the Young's modulus can be derived. The material properties of silicon nitride characterized by three methods are consistent and comparable with one another. The following MEMS materials: SiN, Ni, Ni/SiN bimorph, Nano-Diamond, SiC have been characterized and compared by using different method. Their advantages and disadvantages are also discussed.
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页数:11
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