A 300-mm semiconductor manufacturing foreign material reduction initiative

被引：1

作者：

Long, Christopher W. ^{[1
]}

Sienkiewicz, Thomas ^{[2
]}

Pfeiffer, Gerd ^{[2
]}

Guse, Michael ^{[2
]}

Peterman, James ^{[2
]}

Brendler, Andrew ^{[2
]}

机构：

[1] IBM Corp, Div Res, Essex Jct, VT 05452 USA

[2] IBM Corp, Syst & Technol Grp, Hopewell Jct, NY 12533 USA

来源：

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | 2008年 / 21卷 / 03期

关键词：

foreign material (FM); monitor wafer; statistical process control; tool defect controls; variability reduction; yield enhancement;

D O I：

10.1109/TSM.2008.2001203

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

It is well established that foreign material (FM) in a semiconductor manufacturing process can result in significant unplanned tool down time, reduced product yields, and potential reliability performance issues. This paper will present an overview of the strategy and subsequent results of a multifaceted effort to reduce FM impact during the ramp up of the IBM 300-mm semiconductor manufacturing facility in Hopewell Junction, NY.

引用

页码：308 / 315

页数：8