Mesoscopic modeling of spacing and grain selection in columnar dendritic solidification: Envelope versus phase-field model

We investigate and assess the capability of the mesoscopic envelope model of dendritic solidification to represent the growth of columnar dendritic structures. This is done by quantitative comparisons to phase-field simulations in two dimensions. While the phase-field model resolves the detailed growth morphology at the microscale, the mesoscopic envelope model describes a dendritic grain by its envelope. The envelope growth velocities are calculated by an analytical dendrite-tip model and matched to the numerical solution of the solute concentration field in the vicinity of the envelope. The simplified representation of the dendrites drastically reduces the calculation time compared to phase field. Larger ensembles of grains can therefore be simulated. We show that the mesoscopic envelope model accurately reproduces the evolution of the primary branch structure, the undercooling of the dendrite tips, and the solidification path in the columnar mushy zone. We further show that it can also correctly describe the transient adjustments of primary spacing, both by spacing increase due to elimination of primary branches and by spacing reduction due to tertiary rebranching. Elimination and tertiary rebranching are also critical phenomena for the evolution of grain boundaries between columnar grains that have a different crystallographic orientation with respect to the temperature gradient. We show that the mesoscopic model can reproduce the macroscopic evolution of such grain boundaries for small and moderate misorientation angles, i.e., up to 30 degrees. It is therefore suitable for predicting the texture of polycrystalline columnar structures. We also provide guidelines for the calibration of the main parameters of the mesoscopic model, required to obtain reliable predictions. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.