Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology

被引：137

作者：

Tu, K. N. ^{[1
]}

Liu, Yingxia ^{[1
]}

机构：

[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA

来源：

MATERIALS SCIENCE & ENGINEERING R-REPORTS | 2019年 / 136卷

关键词：

INTERMETALLIC COMPOUND; CELLULAR PRECIPITATION; INTERFACIAL REACTION; WHISKER GROWTH; TIN; DIFFUSION; CU; CHALLENGES; MICROBUMP; SYSTEM;

D O I：

10.1016/j.mser.2018.09.002

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We review five solder joint reactions in 3D IC packaging technology which are of wide interest: (1) Scallop-type growth of Cu6Sn5 in solid-liquid interdiffusion reaction, (2) Whisker-type growth of Sn crystals at room temperature, (3) Layer-type intermetallic compound (IMC) growth in solid state aging, (4) Porous-type growth of Cu3Sn in mu-bumps, and (5) Pillar-type growth of Cu/Sn IMC down to 1 mu m in diameter. The first two have been well covered in books and reviews on solder joint technology, so only certain specific comments will be given here. On the other three, the layer-type IMC growth has been a long standing kinetic problem due to the extremely small concentration gradient across a stoichiometric IMC, but it has been resolved now, following Wagner's approach. The porous-type Cu3Sn was found in 2014. Kinetically, it is a complete cellular precipitation, containing a set of lamellar pores. It is rare because up to now all cellular precipitations are incomplete. The pillar-type Cu/Sn reactions down to 1 mu m in diameter were carried out in 2016. Owing to a large surface/volume ratio, the reaction is controlled by surface diffusion, accompanied by interstitial diffusion of Cu in Sn.

引用

页码：1 / 12

页数：12

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