Power devices for high voltage integrated circuits: New device and technology concepts

被引:5
|
作者
Amaratunga, G [1 ]
Udrea, F [1 ]
机构
[1] Univ Cambridge, Dept Engn, Cambridge CB2 1PZ, England
关键词
D O I
10.1109/SMICND.2001.967503
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Power electronic devices and power integrated circuits will play a crucial role in increasing the efficiency with which electric power is consumed. This paper is concerned with recent trends in high voltage devices for integrated circuits and prospective industrial applications of high voltage power integrated circuits. New device concepts are explored in comparison with classical LDMOSFETs and LIGBTs. Alternative technologies to the conventional junction-isolation technology, such as High Voltage SOI technology are also briefly analysed.
引用
收藏
页码:441 / 448
页数:8
相关论文
共 50 条
  • [31] A Negative Low-Voltage Power Supply Integrated With High-Voltage Devices
    Liang, Lixiao
    Yi, Bo
    Chen, Xing Bi
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2018, 65 (05) : 1849 - 1855
  • [32] An investigation on capacitance-trigger ESD protection devices for high voltage integrated circuits
    Liang, Hailian
    Nie, Weidong
    Gu, Xiaofeng
    Dong, Shurong
    Lau, W. S.
    MICROELECTRONICS RELIABILITY, 2014, 54 (6-7) : 1169 - 1172
  • [33] Research and development of lateral high voltage mosfets for smart power integrated circuits
    Korolev, A.
    Krasukov, A.
    EDM 2006: 7TH ANNUAL INTERNATIONAL WORKSHOP AND TUTORIALS ON ELECTRON DEVICES AND MATERIALS, PROCEEDINGS, 2006, : 128 - 128
  • [34] HIGH-VOLTAGE RESURF LDMOS FOR SMART POWER INTEGRATED-CIRCUITS
    CHARITAT, G
    NEZAR, A
    ROSSEL, P
    REVUE DE PHYSIQUE APPLIQUEE, 1989, 24 (10): : 993 - 1000
  • [35] Power devices and power integrated circuit technology
    Mawby, PA
    IEE PROCEEDINGS-CIRCUITS DEVICES AND SYSTEMS, 2004, 151 (03): : 197 - 197
  • [36] New high voltage device structures in SOI based technology
    Udrea, F
    Milne, WI
    Hemment, PLF
    PROCEEDINGS OF THE EIGHTH INTERNATIONAL SYMPOSIUM ON SILICON-ON-INSULATOR TECHNOLOGY AND DEVICES, 1997, 97 (23): : 401 - 406
  • [37] Defect engineering in SiC technology for high-voltage power devices
    Kimoto, Tsunenobu
    Watanabe, Heiji
    APPLIED PHYSICS EXPRESS, 2020, 13 (12)
  • [38] Efficient Power Map Modeling in Integrated Circuits and Power Devices
    Saxena, Swati
    Jain, Kunal
    PROCEEDINGS 2018 34TH ANNUAL SEMICONDUCTOR THERMAL MEASUREMENT, MODELLING & MANAGEMENT SYMPOSIUM (SEMI-THERM), 2018, : 127 - 134
  • [39] A Latchup-Free ESD Power Clamp Circuit with Stacked-Bipolar Devices for High-Voltage Integrated Circuits
    Park, Jae-Young
    Song, Jong-Kyu
    Jang, Chang-Soo
    Kim, San-Hong
    Jung, Won-Young
    Kim, Taek-Soo
    IEICE TRANSACTIONS ON ELECTRONICS, 2009, E92C (05): : 671 - 675
  • [40] New device concepts, transistor architectures and materials for high performance and energy efficient CMOS circuits in the forthcoming era of 3D integrated circuits
    Esseni, D.
    Badami, O.
    Driussi, F.
    Lizzit, D.
    Pala, M.
    Palestri, P.
    Rollo, T.
    Selmi, L.
    Venica, S.
    2018 IEEE 2ND ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2018), 2018, : 236 - 238