Multichip modules with laminated micro interconnect

被引：0

作者：

Chen, YK ^{[1
]}

Egbert, WC ^{[1
]}

Kane, D ^{[1
]}

Schultz, JC ^{[1
]}

机构：

[1] 3M Co, Fiber Opt & Elect Mat Technol Ctr, St Paul, MN 55144 USA

来源：

1999 INTERNATIONAL CONFERENCE ON HIGH DENSITY PACKAGING AND MCMS, PROCEEDINGS | 1999年 / 3830卷

关键词：

flexible circuit substrate; flip chip; high density package; microvia; multi-chip module; reliability;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

The limited routing capabilities of available substrates for space-limited complex circuits force a cost-performance trade-off for dense circuit designs incorporating high lead count devices. 3M Laminated Micro Interconnect (LMI) technology offers high performance, dense routing in a flexible polymer film package which is compatible with flip chip solder reflow or conductive adhesive die attach techniques. In this paper we discuss the basic LMI construction and contrast it to conventional built-up multilayer approaches. LMI Design Rules and routing capability are illustrated by a GPS receiver test vehicle. The environmental reliability of the LMI structure is characterized with data from Daisy Chain and Kelvin structures built into LMI test vehicles.

引用

页码：46 / 51

页数：6

共 50 条

[1] Acoustic micro-imaging of multichip modules
Adams, Thomas E.
Adams, Thomas E.
Surface mount technology, 1991, 5 (06): : 36 - 38
[2] INTERCONNECT TECHNOLOGIES FOR MULTICHIP MODULES - HIGH-FREQUENCY CHARACTERIZATION AND LOSS ANALYSIS
PEETERS, J
BEYNE, E
BRANDLI, G
MICROELECTRONIC ENGINEERING, 1992, 19 (1-4) : 563 - 566
[3] MULTICHIP MODULES
BUSCHBOM, M
ELECTRONIC PRODUCTS MAGAZINE, 1991, 33 (09): : 43 - 44
[4] MULTICHIP MODULES
BRUCE, RH
MEULI, WP
HO, J
26TH ACM/IEEE DESIGN AUTOMATION CONFERENCE, 1989, : 389 - 393
[5] Broad Frequency LTCC Vertical Interconnect Transition for MultiChip Modules and System On Package Applications
Decrossas, Emmanuel
Glover, Michael D.
Porter, Kaoru
Cannon, Tom
Mantooth, H. Alan
Hamilton, M. C.
2013 EUROPEAN MICROWAVE CONFERENCE (EUMC), 2013, : 104 - 107
[6] A NEW MULTICHIP INTERCONNECT TECHNOLOGY
JACOBS, SL
GUTHRIE, WE
PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2, 1989, : 283 - 293
[7] Cheap multichip modules
Illyefalvi-Vitéz, Z
Vervaet, A
Van Calster, A
Sinnadurai, N
Hrovat, M
Svasta, P
Tóth, E
Belavic, D
Ionescu, R
Dennehy, W
INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 1999, 29 (02): : 71 - 78
[8] MULTICHIP MODULES MARCH ON
CHIN, S
ELECTRONIC PRODUCTS MAGAZINE, 1994, 36 (12): : 25 - 27
[9] FOREWORD - MULTICHIP MODULES
TUCKERMAN, DB
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (04): : 600 - 600
[10] MICROWAVE MULTICHIP MODULES
LEHTONEN, SJ
MOORE, CR
FRANCOMACARO, AS
EDWARDS, RL
CLATTERBAUGH, GV
JOHNS HOPKINS APL TECHNICAL DIGEST, 1994, 15 (01): : 48 - 56

← 1 2 3 4 5 →