Impact of external magnetic field on embedded perpendicular STT-MRAM technology qualified for solder reflow

被引:0
作者
Wang, Chia-Yu [1 ]
Shih, Meng-Chun [1 ]
Lee, Yung-Huei [1 ]
Wang, Wayne [1 ]
Thomas, Luc [2 ]
Lee, Yuan-Jen [2 ]
Liu, Huanlong [2 ]
Zhu, Jian [2 ]
Jan, Guenole [2 ]
Wang, Allen [2 ]
Zhong, Tom [2 ]
Wang, Po-Kang [2 ]
Lin, Derek [1 ]
Chen, Chia-Hsiang [1 ]
Chang, Chih-Yang [1 ]
Weng, Chih-Hui [1 ]
Chiang, Tien-Wei [1 ]
Shen, Kuei-Hung [1 ]
Gallagher, William J. [1 ]
Chuang, Harry [1 ]
机构
[1] Taiwan Semicond Mfg Co, 121,Pk Ave 3,Sci Pk, Hsinchu 300, Taiwan
[2] TDK Headway Technol Inc, Milpitas, CA 95035 USA
来源
2017 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2017年
关键词
pSTT-MRAM; reflow; magnetic field resistance;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
External magnetic field resistance under write, read operations for perpendicular STT-MRAM qualified for 260 degrees C solder reflow is comprehensively reported for the first time. We show that the most critical polarization direction is writing from parallel to anti-parallel state with external field opposed to both the final free layer direction and the bottom pinned layer direction. It is also found that free layer failure to switch is the major cause rather than unexpected pinned layer flipping. Furthermore, various key factors including temperature, write condition and MTJ film stack are also studied here. Finally, we demonstrate that a low chip failure rate of 0.001 ppm can be achieved with an ECC scheme for external magnetic fields up to 240 Oe at 85 degrees C.
引用
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页数:4
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