Microwave Circuits in Paper Substrates Exploiting Conductive Adhesive Tapes

被引：48
作者：
Alimenti, Federico [1 ]
Mezzanotte, Paolo [1 ]
Dionigi, Marco [1 ]
Virili, Marco [1 ]
Roselli, Luca [1 ]
机构：
[1] Univ Perugia, Elect & Informat Engn Dept, I-06125 Perugia, Italy
来源：
IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2012年 / 22卷 / 12期
关键词：
Flexible substrates; green electronics; microwave circuits; paper substrates; transmission lines; DESIGN;
D O I：
10.1109/LMWC.2012.2227141
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this work, a new technique to fabricate microwave circuits in paper substrates is proposed. This technique relies on a copper adhesive tape that is shaped by a photo-lithographic process and then transferred to the hosting substrate by means of a sacrificial layer. Microstrip lines in paper substrates have been electromagnetically characterized accounting also for the adhesive layers. Experimental results show an insertion loss better than 0.6 dB/cm at 10 GHz.
引用
收藏
页码：660 / 662
页数：3
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