Surface behavior based on ion-induced secondary electron emission from semi-insulating materials in breakdown evolution

被引:5
作者
Koc, Emrah [1 ]
Karakose, Sema [1 ]
Salamov, Bahtiyar G. [1 ,2 ]
机构
[1] Gazi Univ, Fac Sci, Dept Phys, TR-06500 Ankara, Turkey
[2] Natl Acad Sci, Inst Phys, Baku 1143, Azerbaijan
来源
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE | 2013年 / 210卷 / 09期
关键词
cathode surface-plasma interactions; electrical breakdown; secondary electron emission; semiconductor cathodes; LOW-PRESSURE GAS; RF BREAKDOWN; DISCHARGE; IONIZATION; ARGON; COEFFICIENTS; PHOTOIONIZATION; SIMULATION; DIFFUSION; TOWNSEND;
D O I
10.1002/pssa.201228767
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This study focuses on analyses of secondary electron emission (SEE) at semiconductor surfaces when the sufficient conditions of space-time distribution occur. Experimental measurements and calculations with the approach of Townsend coefficients, which include the evaluations of ionization coefficient () and SEE coefficient () were performed in high-ohmic InP, GaAs, and Si semiconductor cathodes with argon and air environments in a wide range of E/N (300-10000Td). The direct calculations of were carried out to determine the behavior of cold-semiconductor cathode current in a wide range of microgaps (45-525m). Paschen curves are interpreted in the dependence of large pd range on breakdown voltage through and /N. Ion-induced secondary electrons exhibit the direct behaviors affecting the timescale of breakdown evolution in the vicinity of the Paschen minimum during the natural bombardment process with ions of semiconductor cathodes. Also, when /N rapidly drops and the excitations of gas atoms densely occupy the gas volume, we determined that the photoelectric effect provides a growth for electron emission from semiconductor surfaces at the breakdown stage at the reduced values of E/N. At all pressures, the emission magnitudes of electrons liberated by semiconductor cathodes into vacuum are found as (InP)>(GaAs)>(Si) in breakdown evolution. (C) 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
引用
收藏
页码:1806 / 1816
页数:11
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