The efficiency of tannin as a formaldehyde scavenger chemical in medium density fiberboard

被引:63
作者
Boran, Sevda [1 ]
Usta, Mustafa [2 ]
Ondaral, Sedat [2 ]
Gumuskaya, Esat [2 ]
机构
[1] Karadeniz Tech Univ, Dept Woodworking Ind Engn, TR-61830 Trabzon, Turkey
[2] Karadeniz Tech Univ, Dept Forest Ind Engn, TR-61080 Trabzon, Turkey
关键词
Thermosetting resin; Resins; Mechanical properties; Physical properties; ADHESIVES;
D O I
10.1016/j.compositesb.2011.08.004
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The aim of this study was to determine the effect of tannin content of urea formaldehyde (UF) resin on the panel properties of medium density fiberboard (MDF). Tannin extracted from the bark of white oak (Quercus alba) was added to UF resin at different ratios (based on the resin) to decrease the free formaldehyde content of MDF panels in this study. It was determined that free formaldehyde values of MDF panels decreased when the ratio of tannin content in UF resin increased. However, the modulus of rupture (MOR), modulus of elasticity (MOE), and internal bond strength (IB) of these panels were a little lower, and the thickness swelling (TS) (24 h) and water absorption (WA) (24 h) values were a little higher compared to the control MDF panels. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码:2487 / 2491
页数:5
相关论文
共 17 条
[1]  
[Anonymous], 1993, 317 EN
[2]  
[Anonymous], 1993, 120 EN
[3]  
[Anonymous], 1993, EN 319
[4]  
Breyer RA, 2005, US Patent, Patent No. [035,665, 035665]
[5]  
BS EN 622-5, 2009, 6225 BS EN
[6]  
Conner HA., 1996, ENCY POLYM MAT, V2, P8495
[7]  
EN-310, 1993, WOOD BASED PANELS
[8]  
Greene J. T, 1992, U.S. Pat, Patent No. [5,160,679, 5160679]
[9]   Resistance of cured urea-formaldehyde resins to hydrolysis: A method of evaluation [J].
Kavvouras, PK ;
Koniditsiotis, D ;
Petinarakis, J .
HOLZFORSCHUNG, 1998, 52 (01) :105-110
[10]   Comparison of standard methods and gas chromatography method in determination of formaldehyde emission from MDF bonded with formaldehyde-based resins [J].
Kim, S ;
Kim, HJ .
BIORESOURCE TECHNOLOGY, 2005, 96 (13) :1457-1464