Facile synthesis and electrical performance of silica-coated copper powder for copper electronic pastes on low temperature co-fired ceramic

被引：15

作者：

Dong, Qing ^{[1
,2
]}

Huang, Chao ^{[1
,2
]}

Duan, Guojie ^{[1
,2
]}

Zhang, Fang ^{[1
,2
]}

Yang, De'an ^{[1
,2
]}

机构：

[1] Tianjin Univ, Minist Educ, Key Lab Adv Ceram & Machining Technol, Tianjin 300350, Peoples R China

[2] Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China

来源：

MATERIALS LETTERS | 2017年 / 186卷

关键词：

Silica-coating; Copper paste; Microstructure; Thick films; CONDUCTIVE THICK-FILM;

D O I：

10.1016/j.matlet.2016.09.116

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Silica-coated copper powders with different silica content were prepared by sol-gel process. The pastes with the silica-coated copper powders were prepared and screen-printed on low temperature co-fired ceramic substrate (LTCCs) to form copper films. The films were sintered at 910 degrees C for 1 h under N-2 atmosphere. The morphology of silica-coated copper powder, copper film surface and cross-section were observed. The sheet resistance was also measured. The copper film with 2 wt% silica-coating on LTCCs was well dense and displayed good bonding behavior. The film had a thickness of approximate 8 mu m and a sheet resistance of 6 m Omega/square.

引用

页码：263 / 266

页数：4

共 11 条

[1]

Brown O.W., 2009, [No title captured], Patent No. [CN, US 7504349 B2, 7504349]

[2] Influence of B2O3-SiO2-ZnO-BaO glass ratio and sintering temperature on the microstructure and property of copper thick film for low temperature co-fired ceramic [J].

Chen, Jun ;

Yang, De'an ;

Zhai, Tong ;

Gui, Bingqiang ;

Wang, Qi .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 27 (02) :1929-1937

[3] THE SOL-GEL PROCESS [J].

HENCH, LL ;

WEST, JK .

CHEMICAL REVIEWS, 1990, 90 (01) :33-72

[4] The facile synthesis of Cu@SiO2 yolk-shell nanoparticles via a disproportionation reaction of silica-encapsulated Cu2O nanoparticle aggregates [J].

Jiang, Jianwei ;

Kim, Sang-Ho ;

Piao, Longhai .

NANOSCALE, 2015, 7 (18) :8299-8303

[5] Control of shell thickness in silica-coating of Au nanoparticles and their X-ray imaging properties [J].

Kobayashi, Yoshio ;

Inose, Hiromitsu ;

Nakagawa, Tomohiko ;

Gonda, Kohsuke ;

Takeda, Motohiro ;

Ohuchi, Noriaki ;

Kasuya, Atsuo .

JOURNAL OF COLLOID AND INTERFACE SCIENCE, 2011, 358 (02) :329-333

[6] Direct coating of gold nanoparticles with silica by a seeded polymerization technique [J].

Mine, E ;

Yamada, A ;

Kobayashi, Y ;

Konno, M ;

Liz-Marzán, LM .

JOURNAL OF COLLOID AND INTERFACE SCIENCE, 2003, 264 (02) :385-390

[7] Low loss dielectric materials for LTCC applications: a review [J].

Sebastian, M. T. ;

Jantunen, H. .

INTERNATIONAL MATERIALS REVIEWS, 2008, 53 (02) :57-90

[8] Sinterability and conductivity of silver paste with Pb-free frit [J].

Seo, D. S. ;

Park, S. H. ;

Lee, J. K. .

CURRENT APPLIED PHYSICS, 2009, 9 :S72-S74

[9] Preparation of ultra fine copper-nickel bimetallic powders for conductive thick film [J].

Songping, Wu ;

Li, Jiao ;

Jing, Ni ;

Zhenou, Zeng ;

Song, Liu .

INTERMETALLICS, 2007, 15 (10) :1316-1321

[10] Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging [J].

Wang, YG ;

Zhang, GN ;

Ma, JS .

MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2002, 94 (01) :48-53

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