Circuit modeling of isolation in flip-chip microwave integrated circuits

被引：0
|
作者：
Ito, R
Jackson, RW
机构：
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 1997年
关键词：
D O I：
10.1109/EPEP.1997.634074
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A circuit model for multi-port flipped-chip packaging of microwave integrated circuits is described. The model topology includes the effect of non-ideal isolation between IC ports and predicts resonance behavior in the millimeterwave range. Measurements of a scale model four port are used for verification.
引用
收藏
页码：217 / 220
页数：4
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