FILM-COOLING PERFORMANCE OF ANTI-VORTEX HOLE ON A FLAT PLATE

被引:0
作者
Narzary, Diganta P. [1 ]
LeBlanc, Christopher [1 ]
Ekkad, Srinath [1 ]
机构
[1] Virginia Tech Univ, Dept Mech Engn, Heat Energy Fluid Transport Lab HEFT, Blacksburg, VA 24060 USA
来源
PROCEEDINGS OF THE ASME/JSME 8TH THERMAL ENGINEERING JOINT CONFERENCE 2011, VOL 1 PTS A AND B | 2011年
关键词
DOWNSTREAM; JET;
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Film cooling performance of two hole geometries is evaluated on a flat plate surface with steady-state IR (infrared thermography) technique. The base geometry is a simple cylindrical hole design inclined at 30 degrees from the surface with pitch-to-diameter ratio of 3.0. The second geometry is an anti-vortex design where the two side holes, also of the same diameter, branch out from the root at 15 degrees angle. The pitch-to-diameter ratio is 6.0 between the main holes. The mainstream Reynolds number is 3110 based on the coolant hole diameter. Two secondary fluids - air and carbon-dioxide - were used to study the effects of coolant-to-mainstream density ratio (DR=0.95 and 1.45) on film cooling effectiveness. Several blowing ratios in the range 0.5 -4.0 were investigated independently at the two density ratios. Results indicate significant improvement in effectiveness with anti-vortex holes compared to cylindrical holes at all the blowing ratios studied. At any given blowing ratio, the anti-vortex hole design uses 50% less coolant and provides at least 30-40% higher cooling effectiveness. The use of relatively dense secondary fluid improves effectiveness immediately downstream of the anti-vortex holes but leads to poor performance downstream.
引用
收藏
页码:577 / 585
页数:9
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