Nano/micro-scale surface modifications using copper oxidation for enhancement of surface wetting and falling-film heat transfer

被引：43
作者：
Koeroglu, Batikan [1 ]
Lee, Kee Sung [1 ,2 ]
Park, Chanwoo [1 ]
机构：
[1] Univ Nevada, Dept Mech Engn, Reno, NV 89557 USA
[2] Kookmin Univ, Sch Mech Syst Engn, Seoul 136702, South Korea
来源：
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | 2013年 / 62卷
关键词：
Copper oxide; Chemical immersion; Surface wetting; Contact angle; Nano and micro-scale surface morphology; Falling-film evaporation; HORIZONTAL-TUBE; OXIDE; MICROSCALE;
D O I：
10.1016/j.ijheatmasstransfer.2013.03.040
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
The copper oxidation in NaOH aqueous solutions by a chemical immersion method was used to create nano/micro-scale surface morphology on heat transfer surfaces and control their liquid wettability. Different oxidation conditions, depending on nano/micro-scale surface morphologies, created hydrophilic surfaces (contact angle <90 degrees) with nano-whisker structures of CuO, and hydrophobic surfaces (contact angle >90 degrees) with nano/micro-crystal structures of Cu2O. A heat transfer experiment using a horizontal-tube, falling-film evaporator was performed to study the effect of the nano/micro-scale surface morphology of the evaporator tubes on surface wetting and heat transfer. The surface wetting and heat transfer performance of three different evaporators of plain (untreated), oxidized, and porous-layer coated tubes were compared. (C) 2013 Elsevier Ltd. All rights reserved.
引用
收藏
页码：794 / 804
页数：11
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