The effects of surface contamination on resistance degradation of hot-switched low-force MEMS electrical contacts

被引：18

作者：

Dickrell, DJ ^{[1
]}

Dugger, MT ^{[1
]}

机构：

[1] Sandia Natl Labs, Albuquerque, NM 87185 USA

来源：

Proceedings of the Fifty-First IEEE Holm Conference on Electrical Contacts | 2005年

关键词：

MEMS; contamination; hot-switched; degradation; gold; platinum; arcing;

D O I：

10.1109/HOLM.2005.1518252

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This work investigated the relationship between the resistance degradation in low-force metal contacts and hot-switched operational conditions representative of MEMS devices. A modified nano-indentation apparatus was used to bring electrically-biased gold and platinum surfaces into contact at a load of 100 mu N. The applied normal force and electrical contact resistance of the contact materials was measured simultaneously. The influence of parallel discharge paths for stored electrical energy in the contact circuit is discussed in relation to surface contamination decomposition and the observed resistance degradation.

引用

页码：255 / 258

页数：4

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