Analysis of Thermal Field on Integrated LED Light Source Based on COMSOL Multi-physics Finite Element Simulation

被引：22

作者：

Li, Jingsong ^{[1
]}

Yang, Qingxin ^{[1
]}

Niu, Pingjuan ^{[1
]}

Jin, Liang ^{[1
]}

Meng, Bo ^{[1
]}

Li, Yang ^{[1
]}

Xiao, Zhaoxia ^{[1
]}

Zhang, Xian ^{[1
]}

机构：

[1] Tianjin Polytech Univ, Key Lab Adv Elect Engn & Energy Technol, Tianjin 300387, Peoples R China

来源：

2011 INTERNATIONAL CONFERENCE ON PHYSICS SCIENCE AND TECHNOLOGY (ICPST) | 2011年 / 22卷

关键词：

LED integrated light source; thermal circuit method; COMSOL Multi-physics FEM; temperature distribution; thermal couple method;

D O I：

10.1016/j.phpro.2011.11.024

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

This paper obtained the average integrated heat transfer coefficient for the thermal resistance of a classic of integrated LED light source and its cooling fin-root on the basis of thermal circuit method. Simulation analysis on its steady-state temperature field distribution using COMSOL Multi-physics finite element method was carried out. This method has high precision and intuitive simulation results. The iteration method of the Numerical Analysis is introduced into method for the first time. The results have significant promotion on the LED cast light structure optimization and the affection of reduced heat coupling on the light temperature distribution. The comparison between thermocouple experimental data and calculation results proved the correctness and validity of the proposed method. This experimental study plays a guiding role to thermal analysis and design of other integrated lights. (C) 2011 Published by Elsevier B.V Selection and/or peer-review under responsibility of Garry Lee.

引用

页码：150 / 156

页数：7

共 16 条

[1]

Baureis Peter, 2005, THERM OPT LED BEH P, P145

[2]

Bo Pang, 2010, THERMAL FIELD ANAL I

[3]

Browne J., 2000, Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068), P182, DOI 10.1109/STHERM.2000.837082

[4]

Chen Yuandeng, LED MANUFACTURING TE

[5]

Hui Ma, 2009, BASIC OPERATIONAL GU, P111

[6] A Numerical Study of Thermal and Electrical Effects in a Vertical LED Chip [J].

Hwu, Farn-Shiun ;

Chen, Jyh-Chen ;

Tu, Sheng-Han ;

Sheu, Gwo-Jiun ;

Chen, Hsueh-I ;

Sheud, Jinn-Kong .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2010, 157 (01) :H31-H37

[7] Thermal resistance measurement of LED package with multichips [J].

Kim, Lan ;

Shin, Moo Whan .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2007, 30 (04) :632-636

[8]

Li Qingyang, 2006, NUMERICAL ANAL, P187

[9]

Liu Hong, 2005, NATL DEV FORECASTING

[10]

Ma Zetao, 2006, PHOTOELECTRIC DEVICE, V27, P16

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