The Electrical Resistivity of Ultra-Thin Copper Films

被引：25

作者：

Schmiedl, Ernst ^{[2
]}

Wissmann, Peter ^{[2
]}

Finzel, Hans-Ulrich ^{[1
]}

机构：

[1] FB Chem Hsch Niederrhein, D-47798 Krefeld, Germany

[2] Univ Erlangen Nurnberg, Inst Phys & Theoret Chem, D-8520 Erlangen, Germany

来源：

ZEITSCHRIFT FUR NATURFORSCHUNG SECTION A-A JOURNAL OF PHYSICAL SCIENCES | 2008年 / 63卷 / 10-11期

关键词：

Ultra-Thin Films; Electrical Resistivity;

D O I：

10.1515/zna-2008-10-1118

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The resistivity of ultra-thin metal films is much higher than theoretically predicted by the scattering hypothesis. The effect is discussed with respect to the variation of film thickness for copper films deposited tinder ultra-high vacuum conditions on glass Substrates. The interpretation on the basis or temperature is included into a statistical model leads to reasonable result, even when the variation of consideration, Additional infomation is obtained from photoelectric and field effect measurements.

引用

页码：739 / 744

页数：6

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