Risks for signal integrity in System in Package and possible remedies

被引：4
|
作者：
Rossi, D. [1 ]
Angelini, P. [1 ]
Metra, C. [1 ]
Campardo, G. [2 ]
Vanalli, G. P. [2 ]
机构：
[1] Univ Bologna, DEIS, Viale Risorgimento 2, I-40136 Bologna, Italy
[2] STMicroelectron, Agrate Brianza 20041, Italy
来源：
PROCEEDINGS OF THE 13TH IEEE EUROPEAN TEST SYMPOSIUM: ETS 2008 | 2008年
关键词：
D O I：
10.1109/ETS.2008.23
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We analyze the electrical phenomena that can affect the integrity of the communication among different chips within a System in Package (SiP). We address these issues for a real case, for which electrical parameters are extracted from layout and used to build a netlist employed for electrical characterization. We show that crosstalk, and in particular inductive crosstalk, is the electrical phenomenon mainly affecting signal transmission within the SiP Then, we evaluate the kinds of errors that can be originated. We show that errors caused by inductive coupling among Sip interconnects can be unidirectional only, thus allowing designers to implement error control coding techniques based on All Unidirectional Error Detecting codes. This allows significant cost reduction over the alternate use of non-unidirectional error detecting codes.
引用
收藏
页码：165 / +
页数：2
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