Incorporation of Nanodiamond into an Epoxy Polymer Network with High Thermal Conductivity for Electrical Insulations

被引:0
|
作者
Wang, Wenxuan [1 ]
Bian, Wancong [1 ]
Yang, Ying [1 ]
机构
[1] Tsinghua Univ, Dept Elect Engn, Beijing, Peoples R China
来源
2016 IEEE INTERNATIONAL CONFERENCE ON DIELECTRICS (ICD), VOLS 1-2 | 2016年
关键词
nanodiamond; epoxy resin; composites; thermal conductivity; electrical insulations; COMPOSITES;
D O I
暂无
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
Electrical insulation materials with high thermal conductivity can protect equipment from heat fault and extend the working life of polymeric components. A nanodiamond/epoxy polymer network was developed based on surface modification of the nanodiamond. A simple oxidation strategy was used to modify the surface functional groups of the nanodiamond which were then mixed with epoxy resin in solution. The FTIR data provided clean evidence of the changes on the surface of the nanodiamond. The thermal conductivity of the composites increased by 36% with 20 wt% nanodiamond. The volume resistances of the composites were nearly the same as the original epoxy resin and the dielectric strengths of the composites decreased only by 9.7%. Thus, this nanodiamond/epoxy composite material with high thermal conductivity can be applied in a range of insulation applications at high temperatures.
引用
收藏
页码:868 / 871
页数:4
相关论文
共 50 条
  • [1] Covalent Incorporation of Aminated Nanodiamond into an Epoxy Polymer Network
    Mochalin, Vadym N.
    Neitzel, Ioannis
    Etzold, Bastian J. M.
    Peterson, Amy
    Palmese, Giuseppe
    Gogotsi, Yury
    ACS NANO, 2011, 5 (09) : 7494 - 7502
  • [2] Improvement of thermal conductivity properties of epoxy resin by constructing "sesame cookie"-like nanodiamond-boron nitride
    Chi, Qingguo
    Chen, Ding
    Wang, Xubin
    Zhang, Changhai
    Zhang, Tiandong
    Wu, Guanglei
    Tang, Chao
    POLYMER COMPOSITES, 2025, 46 (04) : 3165 - 3175
  • [3] A review on the thermal conductivity properties of polymer/nanodiamond nanocomposites
    Nan, Bingfei
    Zhan, Yingjie
    Xu, Chang-an
    POLYMER-PLASTICS TECHNOLOGY AND MATERIALS, 2023, 62 (04): : 486 - 509
  • [4] Thermal conductivity and Kapitza resistance of cyanate ester epoxy mix and tri-functional epoxy electrical insulations at superfluid helium temperature
    Pietrowicz, S.
    Four, A.
    Jones, S.
    Canfer, S.
    Baudouy, B.
    CRYOGENICS, 2012, 52 (2-3) : 100 - 104
  • [5] Nanoarchitectonics of BN/AgNWs/Epoxy Composites with High Thermal Conductivity and Electrical Insulation
    Li, Xue
    Weng, Ling
    Wang, Hebing
    Wang, Xiaoming
    POLYMERS, 2021, 13 (24)
  • [6] Nanostructured Electrical Insulating Epoxy Thermosets with High Thermal Conductivity, High Thermal Stability, High Glass Transition Temperatures and Excellent Dielectric Properties
    Mo, Hailin
    Huang, Xingyi
    Liu, Fei
    Yang, Ke
    Li, Shengtao
    Jiang, Pingkai
    IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2015, 22 (02) : 906 - 915
  • [7] Role of silica nanoparticle in multi-component epoxy composites for electrical insulation with high thermal conductivity
    Lee, Dae Ho
    Lee, Nakyung
    Park, Hoyyul
    JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2018, 101 (06) : 2450 - 2458
  • [8] Performances of an epoxy-amine network after introducing the MWCNTs: rheology, thermal and electrical conductivity, mechanical properties
    Liu, Zhongliang
    Li, Hongfeng
    Gu, Jiyou
    Wang, Dezhi
    Qu, Chunyan
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2019, 33 (04) : 382 - 394
  • [9] Thermal conductivity and electrical properties of three-dimensional porous aluminum nitride/epoxy composites
    Wang X.
    Zhang C.
    Zhang T.
    Chi Q.
    Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica, 2023, 40 (06): : 3341 - 3349
  • [10] Study on Preparation, Thermal Conductivity, and Electrical Insulation Properties of Epoxy/AlN
    Dai, Shaotao
    Zhang, Teng
    Mo, Siming
    Cai, Yuan
    Yuan, Wen
    Ma, Tao
    Hu, Lei
    Wang, Bangzhu
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2019, 29 (02)