共 9 条
[1]
[Anonymous], MODELLIERUNG AUSBREI
[3]
Delbare W., 1992, Circuit World, V18, P11, DOI 10.1108/eb046164
[4]
Fick AV., 1855, PHILOS MAG, V10, P30, DOI [10.1080/14786445508641925, DOI 10.1080/14786445508641925, 10.1016/0376-7388(94)00230-V]
[5]
Griese E., 2000, INTERCONNECTS VLSI D, P221
[6]
Optical interconnects by hot embossing for module and PCB technology - The EOCB approach
[J].
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS,
1999,
:1164-1166
[8]
Lehmacher S., 2011, ELECTRON LETT, V36, P1052