Inductive and Ultrasonic Multi-Tier Interface for Low-Power, Deeply Implantable Medical Devices

被引:51
作者
Sanni, Ayodele [1 ]
Vilches, Antonio [2 ]
Toumazou, C. [1 ]
机构
[1] Univ London Imperial Coll Sci Technol & Med, Dept Elect & Elect Engn, Ctr Bioinspired Technol, London SW7 2AZ, England
[2] Brunel Univ, Sch Engn & Design, Uxbridge UB8 3PH, Middx, England
基金
英国工程与自然科学研究理事会;
关键词
Inductive interface for implantable medical devices (IMDs); powering implantable medical devices; ultrasonic interface for IMDs; TRANSCUTANEOUS ENERGY; TRANSMISSION-SYSTEM; DESIGN; GENERATOR; LITHIUM; COIL;
D O I
10.1109/TBCAS.2011.2175390
中图分类号
R318 [生物医学工程];
学科分类号
0831 ;
摘要
We report the development of a novel multi-tier interface which enables the wireless, noninvasive transfer of sufficient amounts of power as well as the collection and transmission of data from low-power, deeply implantable analog sensors. The interface consists of an inductive coupling subsystem and an ultrasonic subsystem. The designed and experimentally verified inductive subsystem ensures that 5 W of power is transferred across 10 mm of air gap between a single pair of PCB spiral coils with an efficiency of 83% using our prototype CMOS logic gate-based driver circuit. The implemented ultrasonic subsystem, based on ultrasonic PZT ceramic discs driven in their low-frequency, radial/planar-excitation mode, further ensures that 29 mu W of power is delivered 70 mm deeper inside a homogenous liquid environment-with no acoustic matching layer employed-with an efficiency of 1%. Overall system power consumption is 2.3 W. The implant is intermittently powered every 800 msec; charging a capacitor which provides sufficient power for a duration of similar to 18 msec; sufficient for an implant mu C operating at a frequency of 500 KHz to transmit a nibble (4 bits) of digitized sensed data.
引用
收藏
页码:297 / 308
页数:12
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