共 26 条
[1]
THETA-JC CHARACTERIZATION OF CHIP PACKAGES - JUSTIFICATION, LIMITATIONS, AND FUTURE
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1989, 12 (04)
:724-731
[3]
Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-D systems
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2001, 24 (04)
:566-590
[5]
An Arnoldi based thermal network reduction method for electro-thermal analysis
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2003, 26 (01)
:186-192
[7]
Codecasa L, 2001, P 19 EUR C CIRC THEO, V2, P161
[8]
CODECASA L, 2004, IEEE T COMP PACKAG T, V27
[9]
Courant R., 1989, METHODS MATH PHYS, VII
[10]
FELDMANN P, 1995, IEEE T COMPUT AID D, V4, P635