Stress induced densification of thin porous low-k films during nanoindentation

被引:0
作者
Okudur, O. O. [1 ,2 ]
Redzheb, M. [2 ]
Vanstreels, K. [2 ]
Zahednamesh, H. [2 ]
Gonzalez, M. [2 ]
De Wolf, I. [1 ,2 ]
机构
[1] Katholieke Univ Leuven, Dept Mat Engn, Kasteelpk Arenberg 44 Bus 2450, B-3001 Leuven, Belgium
[2] IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
来源
2018 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC) | 2018年
关键词
low-k; nanoindentation; pore densification; finite-element; reliability; thin films; porous films; ELASTIC-MODULUS; INDENTATION; SUBSTRATE; HARDNESS;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Simultaneous impact of the substrate and pore densification hinders their differentiation during nanoindentation of porous thin low-k films, causing significant loss of valuable information in terms of nonlinear mechanical behavior. In this study, this issue is overcome by utilizing the substrate independent mechanical property solution with three nanoindenter probes that generate substantially different stress levels and elastic field distributions. Elastic moduli of porous thin films are found to be increasing with indenter sharpness in a non-linear fashion, indicating the influence of pore densification. Results obtained by finite element (FE) simulations with the Gurson model for porous media, qualitatively agree with experimental observations but quantitatively underestimates the pore densification. The proposed multiple-probe approach could facilitate non-linear property characterization of fabricated lowk materials.
引用
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页码:118 / 120
页数:3
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