Failure Analysis of LSI Interconnection by Teraherz Time-Domain Reflectometry.

被引：0

作者：

Hashimoto, Masaichi ^{[1
]}

Okada, Takanori ^{[1
]}

Nishina, Shigeki ^{[1
]}

Ataka, Tsuyoshi ^{[1
]}

Shinohara, Makoto ^{[1
]}

Maehara, Yasuhide ^{[2
]}

Irisawa, Akiyoshi ^{[1
]}

Imamura, Motoki ^{[1
]}

机构：

[1] ADVANTEST Corp, Aoba Ku, 48-2 Matsubara, Sendai, Miyagi 9893124, Japan

[2] RENESAS Engn Serv Corp, 5-20-1 Josuihoncho, Kodaira, Tokyo 1870022, Japan

来源：

Proceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) | 2016年

关键词：

3D IC; QFP; THz; TDR; Failure Analysis technique;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

It is getting significant to identify the fault location in advanced IC packaging technology. However, challenges have been posed to precisely determine the fault location in the failure analysis process, which is difficult to be handled by the conventional electronic based time domain reflectometry. In this work, we developed a time-domain reflectometry technology with extremely small distance-to fault measurement error less than 50 which includes Xray length measuring error, by introducing pulsed terahertz probing signal to Quad Flat Package.

引用

页码：238 / 240

页数：3

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