Thermal storage effects on AlGaN/GaN HEMT

被引:12
作者
Danesin, Francesca [1 ]
Tazzoli, Augusto [1 ]
Zanon, Franco [1 ]
Meneghesso, Gaudenzio [1 ]
Zanoni, Enrico [1 ]
Cetronio, Antonio [2 ]
Lanzied, Claudio [2 ]
Lavanga, Simone [2 ]
Peroni, Marco [2 ]
Romanini, Paolo [2 ]
机构
[1] Univ Padua, Dept Informat Engn, I-35100 Padua, Italy
[2] GaAs Foundry, Selex Sistemi Integrati, I-00131 Rome, Italy
关键词
Silicon carbide - Gallium nitride - Aluminum gallium nitride - High electron mobility transistors - III-V semiconductors - Drain current;
D O I
10.1016/j.microrel.2008.07.008
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The effects of thermal storage on GaN-HEMT devices grown on Sic Substrate have been investigated by DC and Pulsed electrical measurements, breakdown measurements (by means of a Transmission Line Pulser, TLP), and optical and electron microscopy. After 3000 h of thermal storage testing at 300 degrees C, only a limited reduction of the DC drain saturation Current and of the transconductance peak was observed (20% and 25% decrease, respectively). However, pulsed measurements on aged devices clearly highlight a dramatic Current collapse effect that has been attributed to a creation of surface traps in the gate-to-drain and gate-to-source access region. On-state breakdown characterization carried out on aged devices did not highlight any noticeable changes with respect to the untreated devices similarly to the DC characterization. Failure analyses have demonstrated that a loss of adhesion of the passivation layer was responsible for the observed trap formation. An improved passivation deposition process was therefore developed, including a Surface cleaning procedure aimed at preventing passivation detaching. The devices fabricated using this new procedure do not show any enhancement of trapping effects up to 500 h of thermal stress at 300 degrees C. (C) 2008 Published by Elsevier Ltd.
引用
收藏
页码:1361 / 1365
页数:5
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