Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

被引：75

作者：

Wang, Mingna ^{[1
]}

Wang, Jianqiu ^{[1
]}

Feng, Hao ^{[2
]}

Ke, Wei ^{[1
]}

机构：

[1] Chinese Acad Sci, Inst Met Res, State Key Lab Corros & Protect, Shenyang 110016, Peoples R China

[2] China Natl Elect Apparat Res Inst, State Key Lab Environm Adaptabil Ind Prod, Guangzhou 510300, Guangdong, Peoples R China

来源：

CORROSION SCIENCE | 2012年 / 63卷

关键词：

Electronic materials; Alloy; SEM; XPS; Atmospheric corrosion; ELECTROCHEMICAL CORROSION; LEAD; TIN; NACL; BEHAVIOR; ALLOYS; MICROSTRUCTURE; SURFACE;

D O I：

10.1016/j.corsci.2012.05.006

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The aim of this study is to evaluate the effects of Ag3Sn intermetallic compounds (IMCs) on corrosion of Sn-3.0Ag-0.5Cu (SAC305) solder alloy under high-temperature and high-humidity condition. The Ag3Sn IMCs of SAC305 with various size and morphology were obtained by changing cooling rate. Commercial SAC305 solder with smallest Ag3Sn IMCs exhibits better corrosion resistance than air-cooled and furnace-cooled SAC305 solders because microgalvanic corrosion between large cathodic Ag3Sn IMCs plates and anodic Sn matrix decreased the corrosion resistance of air-cooled and furnace-cooled SAC305 solders. (c) 2012 Elsevier Ltd. All rights reserved.

引用

页码：20 / 28

页数：9

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