Numerical Simulation on the Temperature Distribution in Resistance Microwelding of Insulated Cu wire

被引：2

作者：

Mo, Binghua ^{[1
]}

Zhang, Xianfeng ^{[1
]}

Wu, Jiaqing ^{[1
]}

Guo, Zhongning ^{[2
]}

机构：

[1] Guangdong Jidian Polytech, Fac Mech Engn, Guangzhou, Guangdong, Peoples R China

[2] Guangdong Univ Technol, Fac Electromech Engn, Guangzhou, Guangdong, Peoples R China

来源：

ADVANCED MANUFACTURING TECHNOLOGY, PTS 1-4 | 2012年 / 472-475卷

关键词：

Resistance microwelding; Numerical simulation; Insulated copper wire;

D O I：

10.4028/www.scientific.net/AMR.472-475.1143

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper develops a model to simulate wire-to-sheet lapped resistance microwelding (RMW) process. The model employs a coupled thermal electrical mechanical analysis and accounts for temperature-dependent thermophysical properties of materials, contact resistance and the Peltier effect. Results show the interface temperature between the molybdenum electrode and copper wire is higher than the faying surface. The predicted thermal distributes agree well with the experimental data. The proposed model can be applied to predict the effects of the welding parameters.

引用

页码：1143 / +

页数：2

共 5 条

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[3] Measurement of Dynamic Resistance in Resistance Microwelding of Insulated Copper Wire
Mo, Binghua
Qi, Jun
He, Bingqiang
Chen, Ping
Guo, Zhongning
[J]. MATERIALS PROCESSING TECHNOLOGY, PTS 1-3, 2012, 418-420 : 1137 - +
[4] Smithells CJ., 2004, Smithells Metals Reference Book
[5] Zhou Y, 2008, WOODHEAD PUBL MATER, P1, DOI 10.1533/9781845694043

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