Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn-Ag-Cu solder joints during thermal cycling

被引：76
作者：
Han, Y. D. [1 ,2 ]
Jing, H. Y. [1 ,2 ]
Nai, S. M. L. [3 ]
Xu, L. Y. [1 ,2 ]
Tan, C. M. [3 ,4 ]
Wei, J. [3 ]
机构：
[1] Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300072, Peoples R China
[2] Tianjin Key Lab Adv Joining Technol, Tianjin 300072, Peoples R China
[3] Singapore Inst Mfg Technol, Singapore 638075, Singapore
[4] Nanyang Technol Univ, Sch Elect & Elect Engn, Singapore 639798, Singapore
来源：
INTERMETALLICS | 2012年 / 31卷
基金：
高等学校博士学科点专项科研基金; 中国国家自然科学基金;
关键词：
Composites; Thermal properties; Microstructure; Mechanical testing; COMPOSITE SOLDER; CREEP-BEHAVIOR; MECHANICAL-PROPERTIES; INTERMETALLIC GROWTH; MICROSTRUCTURE; PERFORMANCE; MORPHOLOGY; SN-3.5AG; FRACTURE; FATIGUE;
D O I：
10.1016/j.intermet.2012.06.002
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn-Ag-Cu (SAC) solder matrix, to form composite solders. Up to 0.05 wt.% of Ni-CNTs were successfully incorporated. The interfacial microstructure and shear strength of solders on Ni/Au finished Cu substrates were investigated after thermal cycling (from -40 degrees C to +125 degrees C) for up to 2000 cycles. The thermomechanical property results showed an improvement in thermal stability for the composite solders. Results also revealed that after soldering and thermal cycling, the interfacial IMC thickness of the unreinforced solder joint was observed to grow more significantly than that of the composite solder joints. Shear tests results revealed that both composite solder joints which were thermally cycled and assoldered had better ultimate shear strength than their monolithic counterparts. The shear strength of all thermally cycled solder joints decreased with increasing thermal cycles. (C) 2012 Elsevier Ltd. All rights reserved.
引用
收藏
页码：72 / 78
页数：7
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