Pulse-reverse plating of nanocomposite thin films

被引：54
作者：
Podlaha, EJ
Landolt, D
机构：
[1] Lab. de Métallurgie Chimique, Dept. des Matériaux, Ecl. Polytech. Federale de Lausanne
来源：
JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1997年 / 144卷 / 07期
关键词：
D O I：
10.1149/1.1837799
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
A steady-state, pulse-reverse plating method has been developed which permits the enhancement of the particle concentration in electrodeposited metal matrix composite coatings. The procedure is demonstrated for the codeposition of nanosized, gamma-alumina particles in a copper matrix.
引用
收藏
页码：L200 / L202
页数：3
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