Interactions of C in layered Mo-Si structures

被引:7
|
作者
Bosgra, J. [1 ]
Veldhuizen, L. W. [1 ]
Zoethout, E. [1 ]
Verhoeven, J. [2 ]
Loch, R. A. [1 ]
Yakshin, A. E. [1 ]
Bijkerk, F. [1 ,3 ]
机构
[1] Dutch Inst Fundamental Energy Res, FOM Inst DIFFER, NL-3439 MN Nieuwegein, Netherlands
[2] Leiden Univ, Leiden Inst Phys, Leiden, Netherlands
[3] Univ Twente, MESA Inst Nanotechnol, NL-7500 AE Enschede, Netherlands
关键词
Nanoscale interdiffusion; Thermal stability; Mo/Si multilayer mirror; MO/SI MULTILAYERS; THERMAL-STABILITY; CARBIDE; MIRRORS; DIFFUSION; CONTACTS; GROWTH;
D O I
10.1016/j.tsf.2013.06.082
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Interdiffusion of a few nanometers thick C layer with Mo and Si under annealing at a temperature of 600 degrees C was studied using X-ray photoelectron spectroscopy sputter depth profiling. A strong diffusion asymmetry of C in a Mo-Si layered structure is observed. C does interdiffuse with Mo, however, even at 600 degrees C, no interdiffusion of Si and C was observed. Based on these results, the thermal stability of Mo/Si-based layer structures was improved by depositing a Si/C/Mo2C/C/Si layer structure. This structure shows superior thermal stability at 600 degrees C compared to the Mo2C/Si and Mo/Si layer structure. (C) 2013 The Authors. Published by Elsevier B.V. All rights reserved.
引用
收藏
页码:210 / 213
页数:4
相关论文
共 50 条
  • [21] SHOT NOISE IN MO-SI DIODES WITH SCHOTTKY BARRIERS
    KITSAI, ME
    STRIKHA, VI
    SOVIET PHYSICS SEMICONDUCTORS-USSR, 1975, 8 (09): : 1152 - 1153
  • [22] AMORPHIZATION TRANSFORMATION BY MECHANICAL ALLOYING IN THE Mo-Si SYSTEM
    M.W. Li
    R.Z. Tang and W.X. Li (Department of Materials Science and Engineering
    Acta Metallurgica Sinica(English Letters), 1997, (02) : 134 - 140
  • [23] AUGER IN-DEPTH PROFILING OF MO-SI MULTILAYERS
    KONKOL, A
    SULYOK, A
    MENYHARD, M
    BARNA, A
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1994, 12 (02): : 436 - 442
  • [24] SPUTTERING RATE STUDIES ON DIFFERENT MO-SI TARGETS
    UTSUNO, F
    MORI, Y
    HAYASHI, A
    YASUI, I
    JOURNAL OF NON-CRYSTALLINE SOLIDS, 1994, 178 : 250 - 254
  • [25] COMPARISON OF INTERDIFFUSION BEHAVIOR IN MO-SI AND TI-SI MULTILAYERS
    BAI, HY
    WANG, WH
    CHEN, H
    ZHANG, Y
    WANG, WK
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1993, 136 (02): : 411 - 421
  • [26] REVERSE CHARACTERISTICS OF MO-SI EPITAXIAL SCHOTTKY DIODES
    KANO, G
    TAKAYANAGI, S
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1967, ED14 (12) : 822 - +
  • [27] Amorphization transformation by mechanical alloying in the Mo-Si system
    Li, M.W.
    Tang, R.Z.
    Li, W.X.
    Acta Metallurgica Sinica Series A, Physical Metallurgy & Materials Science, 1997, 10 (02): : 134 - 140
  • [28] An overview of the interdiffusion studies in Mo-Si and W-Si systems
    Roy, Soumitra
    Prasad, Soma
    Paul, Aloke
    Defect and Diffusion Forum, 2014, 354 : 79 - 83
  • [29] Tensile properties and strengthening mechanisms of Mo-Si alloy
    Zhang Guo-jun
    Lin Xiao-hui
    Wang Rui-hong
    Liu Gang
    Sun Jun
    INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, 2011, 29 (05): : 608 - 613
  • [30] THERMALLY INDUCED STRUCTURAL MODIFICATION OF MO-SI MULTILAYERS
    STEARNS, DG
    STEARNS, MB
    CHENG, Y
    STITH, JH
    CEGLIO, NM
    JOURNAL OF APPLIED PHYSICS, 1990, 67 (05) : 2415 - 2427