A Novel Silicon-Embedded Toroidal Power Inductor With Magnetic Core
被引:24
作者:
Fang, Xiangming
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机构:
Hong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R China
Fang, Xiangming
[1
]
Wu, Rongxiang
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机构:
Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R China
Wu, Rongxiang
[2
]
Peng, Lulu
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机构:
Hong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R China
Peng, Lulu
[1
]
Sin, Johnny K. O.
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h-index: 0
机构:
Hong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R China
Sin, Johnny K. O.
[1
]
机构:
[1] Hong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R China
[2] Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Peoples R China
DC-DC power conversion;
integrated inductor;
monolithic inductors;
power supply-on-a-chip (PowerSoC);
MICRO-INDUCTORS;
D O I:
10.1109/LED.2012.2234077
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
In this letter, a novel post-CMOS silicon-embedded toroidal power inductor with an MnZn ferrite composite core is proposed and demonstrated. The inductor is accommodated within the groove at the backside of a Si chip and connected to the front-side IC through vias for area saving, electromagnetic interference suppression, and large power-handling capability. A 2.9-mm(2) embedded inductor with an inductance of 43.6 nH and a peak Q-factor of 16.2 is fabricated. It achieves a saturation current of 10 A, making it promising for on-chip light-emitting diode driver applications.
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页码:292 / 294
页数:3
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[11]
Xuehong Yu, 2012, 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS), P325, DOI 10.1109/MEMSYS.2012.6170201