共 11 条
[2]
Harburg D.V., 2012, Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, P1
[4]
Electroplated Metal Buried Interconnect and Through-Wafer Metal-Filled Via Technology for High-Power Integrated Electronics
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2009, 32 (03)
:695-702
[7]
Microfabricated V-groove power inductors for high-current low-voltage fast-transient DC-DC converters
[J].
2005 IEEE 36TH POWER ELECTRONIC SPECIALISTS CONFERENCE (PESC), VOLS 1-3,
2005,
:1513-1519
[8]
On-chip bondwire inductor with ferrite-epoxy coating: A cost-effective approach to realize power systems on chip
[J].
2007 IEEE POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-6,
2007,
:1599-1604