3D thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits

被引：0
|
作者：
Dorkel, JM [1 ]
Tounsi, P [1 ]
Leturcq, P [1 ]
机构：
[1] CNRS,LAB ANAL & ARCHITECTURE SYST,F-31077 TOULOUSE,FRANCE
来源：
TWELFTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS | 1996年
关键词：
plane multilayered systems; two-port network theory; 3D thermal analysis; transient thermal analysis; thermal design of hybrid power circuits;
D O I：
10.1109/STHERM.1996.545096
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：81 / 88
页数：8
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