A Path to 300 mm Hybrid Silicon Photonic Integrated Circuits

被引：0
|
作者：
Bowers, J. E. [1 ]
Bovington, J. T. [1 ]
Liu, A. Y.
Gossard, A. C. [1 ]
机构：
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
来源：
2014 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC) | 2014年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We describe recent advances in hybrid silicon components and photonic integrated circuits. We present a path towards scalable, ultralow cost photonic integrated circuits (PICs) on 300 mm silicon substrates.(C) 2013 Optical Society of America
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页数：3
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