Characterization and Investigation of a Hot-Carrier Effect in Via-Contact Type a-InGaZnO Thin-Film Transistors

被引:7
作者
Hsieh, Tien-Yu [1 ]
Chang, Ting-Chang [1 ,2 ]
Chen, Yu-Te [3 ]
Liao, Po-Yung [1 ]
Chen, Te-Chih [1 ]
Tsai, Ming-Yen [3 ]
Chen, Yu-Chun [1 ]
Chen, Bo-Wei [3 ]
Chu, Ann-Kuo [3 ]
Chou, Cheng-Hsu [4 ]
Chung, Wang-Cheng [4 ]
Chang, Jung-Fang [4 ]
机构
[1] Natl Sun Yat Sen Univ, Dept Phys, Kaohsiung 80424, Taiwan
[2] Natl Cheng Kung Univ, Adv Optoelect Technol Ctr, Tainan 70101, Taiwan
[3] Natl Sun Yat Sen Univ, Dept Photon, Kaohsiung 80424, Taiwan
[4] Chimei Innolux Corp, Prod Technol Ctr, Tainan 350, Taiwan
关键词
Dual gate; hot-carrier; indium gallium zinc oxide (IGZO); thin-film transistors (TFTs); via-contact;
D O I
10.1109/TED.2013.2253611
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Electrical characteristics and the effect of hot-carriers are investigated in via-contact-type a-InGaZnO thin-film transistors. Current-voltage as well as capacitance-voltage measurements are utilized to investigate the impact of top gate bias on device characteristics as well as degradation behaviors caused by a hot-carrier stress. It is found that the redundant source/drain electrodes in via-contact type devices can screen the electric field established by a top gate bias and have significant influence on the device characteristics. Hot-carrier stress brings about electron trapping in the etch stop layer below the redundant electrodes, and this is further verified through modulating the energy band structure by applying a top gate bias during the capacitance-voltage measurement.
引用
收藏
页码:1681 / 1688
页数:8
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