The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum

被引：6

作者：

Lapovok, Rimma ^{[1
,2
]}

Berner, Alex ^{[1
]}

Qi, Yuanshen ^{[1
]}

Xu, Chunjee ^{[3
]}

Rabkin, Eugen ^{[1
]}

Beygelzimer, Yan ^{[4
]}

机构：

[1] Technion Israel Inst Technol, Dept Mat Sci & Engn, IL-3200003 Haifa, Israel

[2] Deakin Univ, Inst Frontier Mat, Waurn Ponds, Vic 3216, Australia

[3] Xian Univ Technol, Sch Mat Sci & Engn, Xian 710048, Shaanxi, Peoples R China

[4] Natl Acad Sci Ukraine, Donetsk Inst Phys & Engn, UA-03028 Kiev, Ukraine

来源：

ADVANCED ENGINEERING MATERIALS | 2020年 / 22卷 / 06期

基金：

欧盟地平线“2020”;

关键词：

conductivities; copper-aluminum hybrid materials; interfaces; intermetallics; powder compaction; reciprocal extrusions; INTERMETALLIC COMPOUNDS; CLAD; DEFORMATION; RESISTIVITY; COMPACTION; EXTRUSION;

D O I：

10.1002/adem.202000058

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Aluminum powder blended with 10, 20, and 30 wt% of copper powder is compacted at 400 degrees C by four reciprocal extrusion passes. Simultaneous compaction and strengthening result in more than double increase in mechanical strength characteristics for 20 and 30 wt% of copper and a significant increase in electrical conductivity for 30 wt% of copper. This phenomenon is investigated here by the expansion of the "effective media" model for a random binary mixture so that it includes the presence of intermetallic phases and considers the distribution of large copper agglomerates.

引用

页数：8

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