Effects of Thermal Aging on Microstructure and Microhardness of Sn-3.7Ag-0.9Zn-1In Solder

被引：8
作者：
Wei, Chen [1 ]
Liu, Yongchang [1 ]
Gao, Zhiming [1 ]
Wan, Jingbo [1 ]
Ma, Changsheng [1 ]
机构：
[1] Tianjin Univ, Coll Mat Sci & Engn, Tianjin Key Lab Adv Jointing Technol, Tianjin 300072, Peoples R China
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2009年 / 38卷 / 02期
基金：
中国国家自然科学基金;
关键词：
Lead-free solder; intermetallics; microstructure; thermal aging; microhardness; LEAD-FREE SOLDERS; AG-SN-ZN; TENSILE PROPERTIES; ALLOYS; CU; JOINTS; NI; RELIABILITY; BEHAVIOR;
D O I：
10.1007/s11664-008-0586-1
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The structural stability of Sn-3.7wt.%Ag-0.9wt.%Zn-1wt.%In solder was explored by thermal aging at 473 K. According to the microstructural observations, the high cooling rate (about 10(2) K/s) applied to the water-cooled specimens prompted the formation of beta-Sn dendrites and inhibited the formation of the AgZn phase. After annealing for 20 h and 50 h, the corresponding microstructure changed significantly, especially the morphology of the intermetallic compounds (IMCs) in the slowly cooled solder. IMC particles grew in order to minimize the system energy. In addition, beta-Sn dendrites grew coarser as the IMCs segregated along their grain boundaries in the water-cooled solder. Furthermore, the Ag-Zn IMCs were suppressed in the water-cooled Sn-Ag-Zn-In solder. It is suggested that coarsening of the microstructure led to significant softening during annealing of the investigated Sn-Ag-Zn-In alloys.
引用
收藏
页码：345 / 350
页数：6
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