Effects of Sb addition on the properties of Sn-Ag-Cu/(Cu, Ni) solder systems

被引：67

作者：

Giuranno, Donatella ^{[1
]}

Delsante, Simona ^{[1
,2
,3
]}

Borzone, Gabriella ^{[1
,2
,3
]}

Novakovic, Rada ^{[1
]}

机构：

[1] Natl Res Council ICMATE CNR, Inst Condensed Matter Chem & Energy Technol, Via Marini 6, I-16149 Genoa, Italy

[2] Univ Genoa, Dept Chem & Ind Chem, Via Dodecaneso 31, I-16146 Genoa, Italy

[3] Unit Natl Consortium Mat Sci & Technol INSTM, Genoa Res, Via Dodecaneso 31, I-16146 Genoa, Italy

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2016年 / 689卷

关键词：

Lead-free solder; SAC187; SAC194Sb; Calorimetry; Wetting Surfaces and interfaces; Microhardness; SN-AG-CU; LEAD-FREE SOLDERS; WETTING BEHAVIOR; INTERMETALLIC COMPOUNDS; INTERFACIAL REACTIONS; ALLOYS; MICROSTRUCTURE; CO;

D O I：

10.1016/j.jallcom.2016.08.035

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The wetting characteristics and microhardness of the Sn-Ag-Cu (SAC) near eutectic alloy and the effects of a small addition of antimony on these properties have been investigated. The contact angle measurements on the two Sn-rich alloys, i.e. the Sn-1.8Ag-0.7Cu and Sn-1.9Ag-0.4Cu-2.1Sb (in wt %) in contact with Cu and Ni substrates have been performed by using a sessile drop apparatus. Although the two solders investigated exhibit different spreading kinetics on Cu and Ni substrates, their final contact angle values indicate a good wetting of these alloys on both substrates. The melting behaviour of two SAC type alloys and the interfaces between these solders and substrates have been characterised by DSC and SEM/EDS analyses, respectively. The results obtained were explained qualitatively by means of the corresponding phase diagrams. The microhardness of SAC solders investigated slightly increases with Sb addition. (C) 2016 Elsevier B.V. All rights reserved.

引用

页码：918 / 930

页数：13

共 50 条

[1] Lead-free solders in microelectronics [J].