Two-phase microfluidics for semiconductor circuits and fuel cells

被引：14

作者：

Hidrovo, CH ^{[1
]}

Kramer, TA ^{[1
]}

Wang, EN ^{[1
]}

Vigneron, E ^{[1
]}

Steinbrenner, JE ^{[1
]}

Koo, JM ^{[1
]}

Wang, FM ^{[1
]}

Fogg, DW ^{[1
]}

Flynn, RD ^{[1
]}

Lee, ES ^{[1
]}

Cheng, CH ^{[1
]}

Kenny, TW ^{[1
]}

Eaton, JK ^{[1
]}

Goodson, KE ^{[1
]}

机构：

[1] Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA

来源：

HEAT TRANSFER ENGINEERING | 2006年 / 27卷 / 04期

关键词：

D O I：

10.1080/01457630500523816

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Industrial trends are presenting major challenges and opportunities for research on two-phase flows in microchannels. Semiconductor companies are developing 3D circuits for which multilevel microfluidic cooling is important. Gas delivery microchannels are promising for PEM fuel cells in portable electronics. However, data and modeling are needed for flow regime stability, liquid entrainment/clogging, and bubble inception/departure in complex 2D and 3D geometries. This paper provides an overview of the Stanford two-phase microfluidics program, with a focus on recent experimental and theoretical progress. Microfabrication technologies are used to distribute heaters, thermometers, pressure sensors, and liquid injection ports along the flow path. Liquid PIV quantifies forces on bubbles, and fluorescence imaging detects flow shapes and liquid volume fraction. Separated flow models account for conjugate conduction, liquid injection, evaporation, and a variety of flow regimes. This work benefits strongly from interactions with semiconductor and fuel cell companies seeking validated models for product design.

引用

页码：53 / 63

页数：11

共 29 条

[1] Water management in PEM fuel cells
Berg, P
Promislow, K
St Pierre, J
Stumper, J
Wetton, B
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2004, 151 (03) : A341 - A353
[2] CHA SW, 2003, P 1 INT C FUEL CELL
[3] FOGG D, 2004, P 3 INT S 2 PHAS FLO
[4] Nonuniform temperature distribution in electronic devices cooled by flow in parallel microchannels
Hetsroni, G
Mosyak, A
Segal, Z
[J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (01): : 16 - 23
[5] HIDROVO CH, 2005, P ICMM2005 3 INT C M
[6] HIDROVO CH, 2004, P IMECE 2004 ASME IN
[7] JIANG L, 2000, P 13 ANN INT C MICR
[8] Closed-loop electroosmotic microchannel cooling system for VLSI circuits
Jiang, LN
Mikkelsen, J
Koo, JM
Huber, D
Yao, SH
Zhang, L
Zhou, P
Maveety, JG
Prasher, R
Santiago, JG
Kenny, TW
Goodson, KE
[J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (03): : 347 - 355
[9] An extension of the flow boiling correlation to transition, laminar, and deep laminar flows in minichannels and microchannels
Kandlikar, SG
Balasubramanian, P
[J]. HEAT TRANSFER ENGINEERING, 2004, 25 (03) : 86 - 93
[10] KANDLIKAR SG, 2003, P 1 INT C MICR MIN R

← 1 2 3 →