共 25 条
[1]
Three-dimensional packaging for power semiconductor devices and modules
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2005, 28 (03)
:404-412
[3]
His C. S., 2011, J MATER SCI, V46, P4695
[5]
Imanaka Y., 2005, MULTILAYERED LOW T 1
[8]
Kim DW, 2001, J AM CERAM SOC, V84, P1286