The Novel Liquid Molding Compound for Fan-out Wafer Level Package

被引：0

作者：

Kan, Katsushi ^{[1
]}

Oi, Yosuke ^{[1
]}

Fujii, Yasuhito ^{[1
]}

Miwa, Masato ^{[2
]}

Sugahara, Michiyasu ^{[2
]}

机构：

[1] Nagase ChemteX Corp, 236 Tatsunocho Nakai, Tatsuno, Hyogo 6794124, Japan

[2] Nagase & CO LTD, Chuo Ku, 5-1 Nihonbashi Kobunecho, Tokyo 1038355, Japan

来源：

2016 International Conference on Electronics Packaging (ICEP) | 2016年

关键词：

Fan-out Wafer level Package(FOWLP); Liquid Molding Compound(LMC); Epoxy; Filler; Viscosity; Warpage; Modulus; Coefficient of thermal expansion(CTE); Through Mold Via(TMV); BALLS;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

In this paper, we present the Novel Liquid Molding Compound and exhibit the requirements for recent Fan-out Wafer Level Package(FOWLP) including reactivity for molding process, CTE & modulus for warpage, filler size for flowability, thermal stability, moisture resistance, adhesion strength for each material. Through Mold Via(TMV) accuracy is also described.

引用

页码：557 / 561

页数：5

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