FBG Head Size Influence on Localized On-Chip Thermal Measurement in IGBT Power Modules

被引:9
作者
Chen, Shiying [1 ]
Vilchis-Rodriguez, Damian [1 ]
Djurovic, Sinisa [1 ]
Barnes, Mike [1 ]
McKeever, Paul [2 ]
Jia, Chunjiang [2 ]
机构
[1] Univ Manchester, Dept Elect & Elect Engn, Manchester M13 9PL, Lancs, England
[2] Offshore Renewable Energy ORE Catapult, Newcastle Upon Tyne NE24 1LZ, Tyne & Wear, England
关键词
Insulated gate bipolar transistors; Sensors; Temperature measurement; Temperature sensors; Temperature distribution; Fiber gratings; Junctions; Fiber Bragg grating (FBG) head size; FBG sensor; insulated gate bipolar transistor (IGBT); junction temperature; on-chip thermal sensing; thermal distribution;
D O I
10.1109/JSEN.2022.3210708
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This article studies the influence of fiber Bragg grating (FBG) head length on insulated gate bipolar transistor (IGBT) direct on-chip thermal sensing performance of FBG sensors. To this end, the surface of a commercial IGBT chip is thermally simulated and experimentally characterized. Uniform FBG sensors with three head sizes are then tested in two promising thermal sensing locations. The study has found that the large thermal gradients in this application create an additional constraint when using longer head lengths. A distortion in the reflected spectrum of the 5-mm FBG sensor is used to illustrate the underlying physical effect, which causes this limitation for IGBT junction temperature measurement. This additionally affects the length of head sizes providing accurate temperature readings of the IGBT surface hotspots, and significantly, this limit is location-dependent in a given IGBT geometry.
引用
收藏
页码:21684 / 21693
页数:10
相关论文
共 19 条
[1]  
[Anonymous], 2016, PROC IEEE INT S MED
[2]   A Failure-Detection Strategy for IGBT Based on Gate-Voltage Behavior Applied to a Motor Drive System [J].
Antonio Rodriguez-Blanco, Marco ;
Claudio-Sanchez, Abraham ;
Theilliol, Didier ;
Gerardo Vela-Valdes, Luis ;
Sibaja-Teran, Pedro ;
Hernandez-Gonzalez, Leobardo ;
Aguayo-Alquicira, Jesus .
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2011, 58 (05) :1625-1633
[3]   A 3-D-Lumped Thermal Network Model for Long-Term Load Profiles Analysis in High-Power IGBT Modules [J].
Bahman, Amir Sajjad ;
Ma, Ke ;
Ghimire, Pramod ;
Iannuzzo, Francesco ;
Blaabjerg, Frede .
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2016, 4 (03) :1050-1063
[4]   Thermal characteristics analysis of an IGBT using a fiber Bragg grating [J].
Bazzo, Joao Paulo ;
Lukasievicz, Tiago ;
Vogt, Marcio ;
de Oliveira, Valmir ;
Kalinowski, Hypolito Jose ;
Cardozo da Silva, Jean Carlos .
OPTICS AND LASERS IN ENGINEERING, 2012, 50 (02) :99-103
[5]   Review of power semiconductor device reliability for power converters [J].
Wang, Bo ;
Cai, Jie ;
Du, Xiong ;
Zhou, Luowei .
CPSS Transactions on Power Electronics and Applications, 2017, 2 (02) :101-117
[6]   Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology-Sensing Head Interfacing [J].
Chen, Shiying ;
Vilchis-Rodriguez, Damian ;
Djurovic, Sinisa ;
Barnes, Mike ;
Mckeever, Paul ;
Jia, Chunjiang .
IEEE SENSORS JOURNAL, 2022, 22 (02) :1309-1320
[7]   Comparison of Junction Temperature Evaluations in a Power IGBT Module Using an IR Camera and Three Thermosensitive Electrical Parameters [J].
Dupont, Laurent ;
Avenas, Yvan ;
Jeannin, Pierre-Olivier .
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2013, 49 (04) :1599-1608
[8]   Online Calculation of the Increase in Thermal Resistance Caused by Solder Fatigue for IGBT Modules [J].
Hu, Zhen ;
Du, Mingxing ;
Wei, Kexin .
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2017, 17 (04) :785-794
[9]   An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue [J].
Li, Hui ;
Hu, Yaogang ;
Liu, Shengquan ;
Li, Yang ;
Liao, Xinglin ;
Liu, Zhixiang .
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2016, 16 (04) :570-575
[10]   Distributed Thermal Monitoring of Wind Turbine Power Electronic Modules Using FBG Sensing Technology [J].
Mohammed, Anees ;
Hu, Borong ;
Hu, Zedong ;
Djurovic, Sinisa ;
Ran, Li ;
Barnes, Mike ;
Mawby, Philip A. .
IEEE SENSORS JOURNAL, 2020, 20 (17) :9886-9894