FBG Head Size Influence on Localized On-Chip Thermal Measurement in IGBT Power Modules

被引:9
作者
Chen, Shiying [1 ]
Vilchis-Rodriguez, Damian [1 ]
Djurovic, Sinisa [1 ]
Barnes, Mike [1 ]
McKeever, Paul [2 ]
Jia, Chunjiang [2 ]
机构
[1] Univ Manchester, Dept Elect & Elect Engn, Manchester M13 9PL, Lancs, England
[2] Offshore Renewable Energy ORE Catapult, Newcastle Upon Tyne NE24 1LZ, Tyne & Wear, England
关键词
Insulated gate bipolar transistors; Sensors; Temperature measurement; Temperature sensors; Temperature distribution; Fiber gratings; Junctions; Fiber Bragg grating (FBG) head size; FBG sensor; insulated gate bipolar transistor (IGBT); junction temperature; on-chip thermal sensing; thermal distribution;
D O I
10.1109/JSEN.2022.3210708
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This article studies the influence of fiber Bragg grating (FBG) head length on insulated gate bipolar transistor (IGBT) direct on-chip thermal sensing performance of FBG sensors. To this end, the surface of a commercial IGBT chip is thermally simulated and experimentally characterized. Uniform FBG sensors with three head sizes are then tested in two promising thermal sensing locations. The study has found that the large thermal gradients in this application create an additional constraint when using longer head lengths. A distortion in the reflected spectrum of the 5-mm FBG sensor is used to illustrate the underlying physical effect, which causes this limitation for IGBT junction temperature measurement. This additionally affects the length of head sizes providing accurate temperature readings of the IGBT surface hotspots, and significantly, this limit is location-dependent in a given IGBT geometry.
引用
收藏
页码:21684 / 21693
页数:10
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