Effects of Variable Amplitude Loading on Lead-Free Solder Joint Propoerties and Damage Accumulation

被引:0
|
作者
Jaradat, Y. [1 ]
Chen, J. [2 ]
Owens, J. E. [2 ]
Yin, L. [2 ]
Qasaimeh, A. [1 ]
Wentlent, L. [1 ]
Arfaei, B. [1 ]
Borgesen, P. [1 ]
机构
[1] SUNY Binghamton, Dept Syst Sci & Ind Engn, POB 6000, Binghamton, NY 13902 USA
[2] SUNY Binghamton, Dept Mech Engn, Binghamton, NY 13902 USA
来源
2012 13TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM) | 2012年
关键词
Reliability; damage accumulation rules; service conditions; life in service; Pb-free; EVOLUTION; FATIGUE; LIFE;
D O I
暂无
中图分类号
O414.1 [热力学];
学科分类号
摘要
Current extrapolations of accelerated test results to life in long term service may be greatly misleading when it comes to lead free solder joints. Notably, realistic service conditions are almost never well approximated by cycling with a fixed amplitude. However, recent results have demonstrated the consistent breakdown of common damage accumulation rules. In isothermal cycling tests the remaining life, after a step-down in amplitude, was invariably shorter than predicted by such a rule, while a step-up tended to have the opposite effect. The present work offers a mechanistic explanation for this and a basis for the development of a practical approach to the assessment of life under realistic service conditions. Realistic BGA joints were cycled individually in a micromechanical tester, monitoring the solder stiffness and the inelastic energy deposition. Cycling was seen to first cause rapid hardening, followed by leveling off in a "cyclic saturation" stage and eventually the initiation and growth of a crack until failure. A temporary increase in amplitude during cycling caused a lasting reduction in hardness, and thus enhanced inelastic energy deposition and damage evolution, afterwards as well. This would dominate during repeated increases and decreases, eventually shortening the remaining life dramatically.
引用
收藏
页码:740 / 744
页数:5
相关论文
共 50 条
  • [1] Effects of Microstructure Evolution on Damage Accumulation in Lead-Free Solder Joints
    Yang, Linlin
    Yin, Liang
    Roggeman, Brian
    Borgesen, Peter
    2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1518 - 1523
  • [2] Loading mixity on the interfacial failure mode In lead-free solder joint
    Gao F.
    Jing J.
    Liang F.Z.
    Williams R.L.
    Qu J.
    Journal of ASTM International, 2010, 7 (05):
  • [3] Loading mixity on the interfacial failure mode in lead-free solder joint
    Gao F.
    Jing J.
    Liang F.Z.
    Williams R.L.
    Qu J.
    ASTM Special Technical Publication, 2011, 1530 : 121 - 138
  • [4] Lead-free Flux Effect in Lead-free Solder Joint Improvement
    Leng, Eu Poh
    Ding, Min
    Ahmad, Ibrahim
    Jiun, Hoh Huey
    Hazlinda, Kamarudin
    IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 541 - 548
  • [5] Study on local recrystallization and damage mode of Lead-free BGA solder joint
    Xu, Xing
    Chen, Gaiqing
    Cheng, Mingsheng
    2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 356 - 359
  • [6] Constitutive and damage model for a lead-free solder
    Shengmin Wen
    Leon M. Keer
    Hareesh Mavoori
    Journal of Electronic Materials, 2001, 30 : 1190 - 1196
  • [7] Constitutive and damage model for a lead-free solder
    Wen, SM
    Keer, LM
    Mavoori, H
    JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (09) : 1190 - 1196
  • [8] Lead-free solders and PCB finish effects on solder joint reliability
    Hunt, Christopher
    Dusek, Milos
    ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006, : 169 - +
  • [9] Microstructural Analysis of Lead-free Solder Joint under Thermo-mechanical Loading
    Hung, Kuo-Kang
    Wu, Mei-Ling
    14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012), 2012,
  • [10] Behavior of lead-free solder under thermomechanical loading
    Wei, Y
    Chow, CL
    Lau, KJ
    Vianco, P
    Fang, HE
    JOURNAL OF ELECTRONIC PACKAGING, 2004, 126 (03) : 367 - 373