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- [1] Effects of Microstructure Evolution on Damage Accumulation in Lead-Free Solder Joints 2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1518 - 1523
- [2] Loading mixity on the interfacial failure mode In lead-free solder joint Journal of ASTM International, 2010, 7 (05):
- [3] Loading mixity on the interfacial failure mode in lead-free solder joint ASTM Special Technical Publication, 2011, 1530 : 121 - 138
- [4] Lead-free Flux Effect in Lead-free Solder Joint Improvement IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 541 - 548
- [5] Study on local recrystallization and damage mode of Lead-free BGA solder joint 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 356 - 359
- [6] Constitutive and damage model for a lead-free solder Journal of Electronic Materials, 2001, 30 : 1190 - 1196
- [8] Lead-free solders and PCB finish effects on solder joint reliability ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006, : 169 - +
- [9] Microstructural Analysis of Lead-free Solder Joint under Thermo-mechanical Loading 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2012), 2012,